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Filescan Ltd- Coolface Systems Temperature control for electronic enclosures |
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The
design requirements for this design was to produce a low cost enclosure
for the electronic components of the Coolface system.
The design is modular, enabling multiple applications and configurations to be built from a single design and set of tooling. The design consists of extruded components
for the main case body, allowing the modular construction
to be easily adapted to any size or configuration. The top
and end components are injection moulded ABS. |
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The configurations allow "Through Panel" mounting or surface mounting for temperature control of either a hot or cold surface. The construction allows an internal volume to be cooled or cold air ducted directly to a particular hot spot. Each module provides 200W of capacity. The controlling electronics are available as simple power supplies or intelligent with in-build temperature control and display for local or remote programming. Design completed using Inventor V5 Click on logo for Link to Filescan Website. |
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